Semiconductor industry mechanical parts

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Product Details

Our Manufacturing Strength & Core Equipment

We boast a modern, clean production base equipped with more than 30 high-speed and high-precision CNC machining centers and 2 advanced 5-axis CNC milling centers, covering a wide range of machining platform sizes (up to 3000mm × 2000mm × 1200mm) to accommodate diverse semiconductor part specifications. Beyond CNC machining, our comprehensive production processes include Electrical Discharge Machining (EDM), wire cutting, grinding, polishing, vacuum heat treatment, and precision assembly—enabling us to realize one-stop service from raw material processing to finished product delivery, ensuring process continuity and product consistency.


Semiconductor Mechanical Parts: Advantages, Application Scenarios & Customer Cases

Our CNC machined semiconductor mechanical parts are engineered for ultra-precision (up to ±0.002mm), high mechanical strength, and excellent corrosion resistance—critical for the harsh operating environments of semiconductor manufacturing (high vacuum, high temperature, corrosive gases). The 5-axis CNC machining technology allows for complex contour processing of irregular parts (such as semiconductor equipment chambers, precision guide rails) in a single clamping, minimizing cumulative errors and ensuring tight dimensional tolerances. These parts are widely applied in semiconductor equipment manufacturing, including wafer processing equipment, semiconductor packaging and testing equipment, lithography machines, and CVD/PVD equipment, providing reliable structural support and precise positioning functions for core semiconductor production links.


Typical Customer Cases

Case 1: European Semiconductor Equipment Manufacturer - We collaborated with a leading European manufacturer of wafer processing equipment to produce precision stainless steel chamber parts. The client required ultra-high machining precision (±0.003mm), strict surface roughness (Ra ≤ 0.05μm), and corrosion resistance to withstand plasma etching environments. Leveraging our 5-axis CNC machining centers and vacuum heat treatment technology, we completed the production of 5,000 sets of chamber parts within 35 working days. The products passed the client's rigorous vacuum tightness and corrosion resistance tests, with a qualification rate of 99.9%. We have since become their long-term strategic partner, supplying 20,000+ sets of precision parts annually for their global equipment production lines.

Case 2: Southeast Asian Semiconductor Packaging & Testing Enterprise - For a large-scale semiconductor packaging and testing enterprise in Southeast Asia, we customized precision aluminum alloy positioning fixtures and guide rail components. The key requirements included high dimensional stability (thermal expansion coefficient ≤ 20×10⁻⁶/°C) and compatibility with cleanroom environments (Class 100). Our technical team optimized the material selection (7075 aluminum alloy with T6 heat treatment) and machining process, reducing the part deformation rate by 30% compared to the client's previous supplier. The products have been successfully applied to their high-speed packaging lines, improving production efficiency by 15%. We now provide them with monthly supply support of 8,000+ sets of precision parts.


Visualized Production Process (Semiconductor-Specific)

We adhere to a strict, clean, and transparent production process to ensure product quality meets semiconductor industry standards. Each precision part undergoes the following standardized procedures:

  • Semiconductor-Grade Raw Material Selection & Inspection: Sourcing high-purity materials (stainless steel 316L, titanium alloy Ti-6Al-4V, aluminum alloy 7075, PEEK engineering plastic) from certified suppliers. Conducting strict incoming inspections (chemical composition analysis via光谱仪, material purity testing, surface defect detection) to ensure raw material meets semiconductor industry requirements.

  • Industry-Specific Design Optimization & Programming: Our engineering team (with 5+ years of semiconductor part machining experience) optimizes client drawings to enhance part stability and machining feasibility. Compiling precise CNC programs with optimized cutting parameters to avoid material deformation and ensure surface quality.

  • Precision CNC Machining: Utilizing high-speed CNC and 5-axis CNC machining centers to perform high-precision cutting in a clean workshop (Class 1000) to prevent particle contamination.

  • Secondary Processing & Heat Treatment: Conducting EDM/wire cutting for complex microstructures, followed by vacuum heat treatment to improve material hardness and dimensional stability.

  • Semiconductor-Grade Surface Treatment: Implementing customized surface treatment processes (polishing, passivation, hard anodizing) to meet cleanroom and corrosion resistance requirements.

  • Strict Quality Inspection (Semiconductor Standard): Using high-precision testing equipment (CMM with accuracy ±0.001mm, laser measuring instrument, surface roughness tester) to conduct full-dimensional inspection. Conducting vacuum tightness, corrosion resistance, and dimensional stability tests for key parts. All products are 100% inspected before delivery.

  • Clean Packaging & Shipping: Using anti-static, dust-free packaging materials to protect parts during transportation. Providing cleanroom-compatible packaging options as required.


Product Classification (By Industry, Material & Part Type)

Industry

Material

Part Type

Remarks

Semiconductor Wafer Processing

Stainless Steel 316L, Titanium Alloy Ti-6Al-4V

Wafer Chuck, Process Chamber Parts, Precision Guide Rails

High vacuum tightness, corrosion resistance to plasma

Semiconductor Packaging & Testing

Aluminum Alloy 7075, PEEK Engineering Plastic

Positioning Fixtures, Lead Frame Guides, Testing Probe Holders

High dimensional stability, anti-static, cleanroom-compatible

Lithography Equipment

Invar Alloy (Low Expansion), Stainless Steel 304

Lens Mounts, Precision Adjustment Components, Structural Brackets

Ultra-low thermal expansion coefficient, high precision

CVD/PVD Equipment

Tungsten Alloy, Stainless Steel 316Ti

Deposition Chamber Parts, Gas Nozzles, Heating Elements Holders

High temperature resistance, corrosion resistance to reactive gases


Technical Parameters

Parameter Item

Specification

Remarks

Machining Precision

±0.002mm ~ ±0.005mm

Measured by high-precision CMM; achievable up to ±0.001mm for micro-parts

Material Range

Stainless Steel (304/316/316L/316Ti), Titanium Alloy (Ti-6Al-4V), Aluminum Alloy (6061/7075), Invar Alloy, PEEK/PTFE Engineering Plastic, Tungsten Alloy

All materials meet semiconductor industry purity standards

Surface Treatment Options

Precision Polishing (Ra ≤ 0.05μm), Passivation, Hard Anodizing, Vacuum Plating, PTFE Coating

All treatments are cleanroom-compatible and anti-corrosive

Minimum/Maximum Size

Minimum: 2mm × 2mm × 1mm; Maximum: 1500mm × 800mm × 600mm

Covers micro-components and large structural parts for semiconductor equipment

Production Cycle

Sample: 5-7 working days; Mass Production: 15-40 working days

Depends on part complexity, material type, and order quantity; expedited service available


Our Core Competitiveness

  • Semiconductor-Specific Technical Team: A team of 25+ engineers and technicians with 8+ years of experience in semiconductor part machining. Providing professional technical support from drawing optimization to process customization, familiar with SEMI standards.

  • Strong Production Capacity: Equipped with 30+ high-speed precision CNC machining centers and 2 5-axis CNC machining centers, supporting monthly production capacity of 30,000+ sets of semiconductor parts. Clean workshop (Class 1000) ensures product cleanliness.

  • Strict Quality Management System: Certified with ISO9001:2015, ISO14644 (Cleanroom Standard), and SEMI S2/S8 (Semiconductor Equipment Safety Standards). Implementing full-process quality control with a dedicated quality inspection team of 8+ professionals, ensuring product qualification rate ≥ 99.8%.

  • Perfect Supply Chain: Long-term strategic cooperation with semiconductor-grade material suppliers (e.g., Sandvik, Alcoa) and professional surface treatment factories, ensuring stable supply of high-purity materials and consistent surface treatment effects.

  • Global Shipping Support: Cooperating with international logistics giants (DHL, FedEx, Maersk) to provide door-to-door shipping services covering 150+ countries and regions. Providing SEMI-compliant packaging and professional customs clearance documents for semiconductor products.

  • Reliable Quality Assurance: Providing 1-year quality guarantee for all semiconductor parts.  Supporting third-party inspection (SGS, BV, TÜV) to ensure product meets international semiconductor standards.


Why Choose Us?

With over 10 years of experience in precision CNC machining for the semiconductor industry, we have established long-term cooperative relationships with 20+ semiconductor equipment manufacturers and packaging/testing enterprises from Europe, North America, Japan, South Korea, and Southeast Asia. Our successful cases in serving leading industry brands fully verify our technical strength and ability to meet strict semiconductor industry requirements. We focus on customer needs, provide flexible customization services (supporting 2D/3D drawing customization and reverse engineering), and our professional foreign trade team (with semiconductor industry expertise) provides 24/7 online consultation to respond to your inquiries and technical support in a timely manner.

Contact us now to get a free quote and professional technical solution! Let us be your trusted partner for high-precision mechanical parts in the semiconductor industry.

Inquiry

+86 19953268588

+86 19953268588

info@xljmetal.com